BEAT365唯一官网博士生学位论文及学位申请成果公示(侯宏宇) 2024-07-31



个人信息:

姓名:侯宏宇

专业:管理科学与工程

学号:4115008031

班级:B1541

导师:吴锋

学位论文题目:

  考虑消费者公平关切的数字内容产品定价策略研究

学位申请成果目录:

[1] Hou, Hongyu, Feng Wu*, and Xiangyin Kong. "Optimal pricing strategy for content products under competition: Pay-as-you-want or fixed-price?." Computers & Industrial Engineering 181 (2023): 109298.SCIJCR分区Q1;BEAT365唯一官网最具学术影响力期刊,序号:37

[2] Hou, Hongyu, Feng Wu*, and Xin Huang. "Dynamic pricing strategy for content products considering consumer fairness concerns and strategic behavior." Industrial Management & Data Systems (2024).SCIJCR分区Q1;BEAT365唯一官网最具学术影响力期刊,序号:101

[3] Hou Hongyu, and Wu Feng*. "AUTOMATED DEFECT INSPECTION ALGORITHM FOR SEMICONDUCTOR-PACKAGED CHIPS." International Journal of Industrial Engineering 27.5 (2020).

[4] Huang Xin*, Hou Hongyu, and Sun Mingyao. "A novel temporal recommendation method based on user query topic evolution." Knowledge-Based Systems 241 (2022): 108239.

[5] Chang Fengjiao, Wu Feng*, Chang Fengtian, and Hou Hongyu. "Research on adaptive transmission and controls of COVID-19 on the basis of a complex network." Computers & Industrial Engineering 162 (2021): 107749.

[6] Hou Hongyu and Wu Feng*. Optimal Product Line Strategy for Content Products considering Consumers’ Fairness Concerns. The 2024 POMS International Conference in China, June 28-30, 2024, Hefei, China.

[7] Hou Hongyu and Wu Feng*. Impact of blockchain technology and fairness concern on supplier’s optimal product line design of virtual goods. The 16th International Conference on Operations and Supply Chain Management, August 17-18, 2022, Tianjin, China.

[8] Hou Hongyu and Wu Feng*. Dynamic Pricing Strategy for Content Products Considering Consumers’ Fairness Concern. The 2022 POMS International Conference in China, June 24-27, 2022, Xi’an, China.

[9] Hou Hongyu and Wu Feng*. Comparison research on X-ray image quality defects detection algorithm in semiconductor manufacturing. 2019 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering, April 19-21, 2019, Hangzhou, China.

公示时间:20240731